JPH0142356Y2 - - Google Patents
Info
- Publication number
- JPH0142356Y2 JPH0142356Y2 JP12003283U JP12003283U JPH0142356Y2 JP H0142356 Y2 JPH0142356 Y2 JP H0142356Y2 JP 12003283 U JP12003283 U JP 12003283U JP 12003283 U JP12003283 U JP 12003283U JP H0142356 Y2 JPH0142356 Y2 JP H0142356Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- integrated circuit
- hybrid integrated
- coated
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12003283U JPS6027441U (ja) | 1983-08-01 | 1983-08-01 | 混成集積回路装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12003283U JPS6027441U (ja) | 1983-08-01 | 1983-08-01 | 混成集積回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6027441U JPS6027441U (ja) | 1985-02-25 |
JPH0142356Y2 true JPH0142356Y2 (en]) | 1989-12-12 |
Family
ID=30275242
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12003283U Granted JPS6027441U (ja) | 1983-08-01 | 1983-08-01 | 混成集積回路装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6027441U (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2571795Y2 (ja) * | 1990-03-08 | 1998-05-18 | 株式会社村田製作所 | 樹脂封止形電子部品 |
JP2005243746A (ja) * | 2004-02-24 | 2005-09-08 | Nippon Chemicon Corp | バリスタ |
PL2997099T3 (pl) * | 2013-05-31 | 2021-04-19 | Elantas Pdg Inc. | Formułowane kompozycje żywic poliuretanowych do powlekania zalewowego zespołów obwodu elektronicznego |
-
1983
- 1983-08-01 JP JP12003283U patent/JPS6027441U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6027441U (ja) | 1985-02-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5723369A (en) | Method of flip chip assembly | |
JPH10223801A (ja) | 半導体素子の実装構造 | |
JP2781020B2 (ja) | 半導体装置およびその製造方法 | |
JP2001015682A (ja) | 樹脂封止型電子装置 | |
JP2977763B2 (ja) | 包封されたチップオンボード電子モデュールの製造方法 | |
JPH0142356Y2 (en]) | ||
US4639830A (en) | Packaged electronic device | |
EP0260360B1 (en) | Resin-sealed semiconductor device | |
JP2944768B2 (ja) | 集積回路部品とその製造方法 | |
JPS622778Y2 (en]) | ||
JP2506938Y2 (ja) | 樹脂封止型電子回路装置 | |
JPH11284096A (ja) | 半導体パッケージ | |
JPS61136249A (ja) | ハイブリツドic | |
JPH04252041A (ja) | 混成集積回路の製造方法 | |
JP2779843B2 (ja) | 電子部品搭載用基板及び電子部品パッケージ | |
JPH0536299Y2 (en]) | ||
JP2001308230A (ja) | 半導体装置 | |
JPH07135203A (ja) | 半導体装置 | |
JPS6025915Y2 (ja) | 電子部品実装構造 | |
JPS6342530Y2 (en]) | ||
JPS601847A (ja) | 混成集積回路 | |
JP2555519Y2 (ja) | 表面実装樹脂封止型半導体装置 | |
JPS6112700Y2 (en]) | ||
JPS5979555A (ja) | 樹脂封止型半導体装置の製造方法 | |
JPS5933981B2 (ja) | 半導体装置 |